| 1. | Tp - 96 , plated through hole integrity test procedure for electrical connectors
电连接器电镀通孔完整性的试验程序tp - 96 |
| 2. | Micro - resistance test method of plating thickness of plated through holes for printed boards
印制板金属化孔镀层厚度测定方法微电阻法 |
| 3. | Reliability of plated through hole ( pth ) has close relationship with technology parameters during manufacture process
摘要镀通孔的可靠性与制造过程工艺参数有非常密切的关系。 |
| 4. | Sectional specification for capability approval of manufacture of double - sided rigid printed wiring boards of assessed quality with plated through holes
级质量评定的带穿透镀膜孔的双面硬性印刷电路板制造商性能鉴定用分规范 |
| 5. | Sectional specification for capability approval of manufacturers of multilayer rigid printed wiring boards of assessed quality with plated through holes
经质量评定的带穿透镀膜孔的多层刚性印制电路板制造商性能鉴定用分规范 |
| 6. | Harmonized system of quality assessment for electronic components : sectional specification : single and double sided printed boards with plated through holes
电子元器件质量评定统一体系.分规范:具有镀通孔的单面和双面印制电路板 |
| 7. | Sectional specification for capability approval of manufacturers of single - or double - sided printed wiring boards of assessed quality without plated through holes
经质量评定的无穿透镀膜孔的单面或双面印制电路板制造商性能鉴定用分规范 |
| 8. | Harmonized system of quality assessment for electronic components - capability detail specification : single and double - sided printed boards with plated through holes
电子元器件用质量评估协调体系.性能详细规范:通孔单面和双面印刷电路板 |
| 9. | Harmonized system of quality assessment for electronic components - capability detail specification : single and double sided printed boards with plated through holes
电子元器件用质量评估协调体系.性能详细规范:具有通孔的单面和双面印制电路板 |
